The soldering between cell and solder ribbon is generally subjected to destructive peel tests to assess the quality. The Peel Force Tester can test the solder joint between ribbon and cell, even if bonded, and ascertain the quality. The test is standardized so as to achieve replicable test procedures, also with different formats.
The M10 Peel Force Tester can be operated without the need for tools, which makes it easy to insert cells and change the peeling angle. M10 HMI is used for operations. All input is done via a touchscreen.
Measurement curves can be analyzed, and several curves can even be compared in parallel. The current force value and path or time value are always shown for each measuring point. The average force value of the curves is also displayed. Users can be optionally assigned to a user group whose rights can be freely edited.
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